• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
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    • 专利摘要:
    Systems and methods are provided for isolating superconducting magnets, such as a cryogenic container of a Magnetic Resonance Imaging (MRI) system, having one or more superconductive magnets therein. A system includes thermal insulation (50) having a first plurality of reflector layers (60) and a non-deformed spacer layer (62) between adjacent layers in the first plurality of reflector layers (60). The thermal insulation further includes a second plurality of reflector layers and a deformed spacer layer (62) between adjacent layers in the second plurality of reflector layers.
    公开号:AT511505A2
    申请号:T675/2012
    申请日:2012-06-12
    公开日:2012-12-15
    发明作者:
    申请人:Gen Electric；
    IPC主号:
    专利说明:

    PHONE: (+43 1) 532 41 30-0 TELEFAX: (+43 1) 532 41 31 E-MAIL: MAIL@PATENT.AT
    SCHÜTZ u. PARTNER
    PATENT OFFICES EUROPEAN PATENT AND TRADEMARK ATTORNEYS A-1200 VIENNA, BRIGITTENAUER LAND 50
    DIPL.-ING. WALTER WOODS DIPL.-ING. DR, TECHN. ELISABETH SCHOBER
    BACKGROUND OF THE INVENTION
    The present invention relates generally to cryogenically cooled superconducting magnets, such as for magnetic resonance imaging (MRI) systems, and more particularly to apparatus and methods for isolating a cryogenic container or thermal shield for superconducting magnets ,
    In MRI systems with superconducting coils, the coils forming the superconducting magnets are cooled cryogenically using a cryogenic container, which is typically a helium container (also referred to as a cryostat). During certain operating conditions or during a transfer of the MRI system, generated heat may overheat a local area of the coil and create a normal zone in which the conductor loses the superconducting property and transitions to a state of normal resistance. The normal zone will propagate through the coil due to Joule heat and thermal conduction, resulting in a cancellation event. The erasure is accompanied by a rapid decoction of the helium escaping from the cryogenic bath in which the magnetic coils are submerged. Any deletion, followed by refilling and rebooting the magnet, is on
    SUBSEQUENT • "expensive and time-consuming event. Accordingly, cooling and isolation systems are used for MRI systems to minimize the likelihood of overheating of the superconducting solenoids.
    For example, the cryogenic cooling system of some of these MRI systems includes a chiller, such as a cooling head within a cooling head collar, which operates to recombine vaporized coolant to continuously cool superconducting solenoids during system operation. Additionally, thermal isolation may be provided around the helium vessel to isolate the helium from, for example, external thermal radiation or other forms of thermal transfer into or out of the helium vessel. However, to provide isolation or to improve the thermal insulation properties of these conventional thermal insulation, additional thermal layers or expensive modifications are required.
    BRIEF DESCRIPTION OF THE INVENTION
    In accordance with various embodiments, a thermal insulation for a superconducting magnet is provided which includes a first plurality of reflector layers and a non-deformed spacer layer between adjacent layers of the first plurality of reflector layers. The thermal insulation contains
    POSSIBLE - 3 · ♦ «· * · ·« · < Further, a second plurality of reflector layers and a deformed spacer layer between adjacent layers of the second plurality of reflector layers.
    In accordance with other embodiments, there is provided an (MRI) magnet device including a container having therein liquid helium and a superconducting magnet in the container. The MRI magnet device also includes a thermal shield surrounding the helium reservoir. The MRI magnet apparatus also includes thermal insulation surrounding at least a portion of at least one of the container or thermal shield, wherein the thermal insulation comprises a plurality of reflector layers having an undeformed spacer layer between adjacent reflector layers and a plurality of reflector layers has a deformed spacer layer between adjacent reflector layers.
    In accordance with further embodiments, a method of forming thermal isolation for a magnetic resonance imaging (MRI) system is provided. The method includes deforming a plurality of spacer layers and stacking a first plurality of reflector layers having undeformed spacer layers therebetween. The method also includes stacking a second plurality of reflector layers with deformed spacer layers therebetween.
    FOLLOW-UP 4
    The method further includes forming a multilayer thermal insulation with the first and second plurality of reflector layers.
    BRIEF DESCRIPTION OF THE DRAWINGS
    FIG. 1 is a simplified block diagram of a Magnetic Resonance Imaging (MRI) magnetic system illustrating thermal isolation formed in accordance with various embodiments. FIG.
    Fig. 2 is a diagram illustrating a thermal insulation arrangement for a cryogenic container formed in accordance with various embodiments.
    FIG. 3 is a simplified diagram illustrating a thermal isolation arrangement formed in accordance with an embodiment. FIG.
    FIG. 4 is a block diagram of a portion of a thermal insulation formed in accordance with various embodiments. FIG.
    FIG. 5 is an elevational view of a spacer layer formed in accordance with an embodiment. FIG.
    FOLLOW-UP 5
    &Quot; FIG. 6 is a perspective view of the cladding layer of FIG. 5. FIG.
    Fig. 7 is an elevational view of a spacer layer formed in accordance with another embodiment.
    FIG. 8 is a perspective view of the spacer layer of FIG. 7. FIG.
    Fig. 9 is an elevational view of a spacer layer formed in accordance with another embodiment.
    FIG. 10 is a perspective view of the spacer layer of FIG. 9. FIG.
    Fig. 11 is a diagrammatic illustration of a multilayer thermal insulation formed in accordance with an embodiment.
    Fig. 12 is a diagrammatic illustration of a multilayer thermal insulation formed in accordance with one embodiment within an MRI system.
    FIG. 13 is a flow chart of a method of forming a thermal insulation in accordance with various embodiments. FIG. Fig. 14 is a block diagram of an MRI system in which thermal isolation formed in accordance with various embodiments may be implemented.
    DETAILED DESCRIPTION OF THE INVENTION
    The foregoing summary, as well as the following detailed description of certain embodiments, will be better understood when read in conjunction with the appended drawings. With regard to the scope of the drawings, which depict functional block diagrams of various embodiments, functional blocks do not necessarily indicate subdivisions between the hardware. Thus, for example, one or more functional blocks may be implemented in a single piece of hardware or in many pieces of hardware. It is understood that various embodiments are not limited to the arrangements and the instruments shown in the drawings.
    As used herein, an element or a step which is mentioned in the singular and the word
    FOLLOWING 7 ··· «" a " or "one" is not to be understood as excluding the plural of these elements or steps, unless the exclusion is explicitly mentioned. Further, references to "one embodiment " not to be interpreted as precluding the existence of additional embodiments which also incorporate said features. Rather, unless explicitly stated otherwise, embodiments that include one element or a plurality of elements may " or "include" that have a special property, additional contain such elements that do not have this property.
    Various embodiments provide systems and methods for thermally isolating a magnetic resonance imaging (MRI) system, and more particularly, thermal isolation of the cryogenic vessel of the MRI system. In particular, multi-layered insulation (MLI) for a cryogenic container having reflector layers and spacer layers may be provided for isolation of an MRI magnet within the cryogenic container. In various embodiments, one or more of the spacer layers are deformed (e.g., folded, stamped or wrinkled), such as from a generally uniform or planar sheet shape. As used herein, deformation of the spacer layers refers to any type of deformation, such as the change in shape, structure, etc., of the spacer layers.
    By adopting at least one embodiment, the ground or conductive distance between adjacent layers of the MRI structure is increased and the area of contact area between the spacer and reflector layers is also reduced, which lowers the heat conduction loss. In addition, a reduced number of layers can also be used to provide the same level of heat dissipation performance.
    Figures 1 and 2 illustrate embodiments comprising MLI formed in accordance with various embodiments. In particular, Figures 1 and 2 are simplified block diagrams illustrating a superconducting magnet system, such as an MRI magnet system 20, which includes one or more superconductive magnets. It should be noted that like reference numerals represent like parts throughout the figures. It should be further noted that the relative arrangements of various embodiments are shown for ease of illustration and do not necessarily depict the location or orientation of various components in various embodiments.
    The MRI magnet system 20 includes a container 22 that holds a liquid refrigerant, such as liquid helium. The container 22 is therefore in this imple mentation form a helium container, which may also be referred to as helium pressure vessel. The container 22 is surrounded by a vacuum container 24 and contains therein and / or in between a thermal container.
    FOLLOWING 9 ···· · ·· «
    The shield 26 can be, for example, a thermally insulating radiation shield. A cooling head 28, which in various embodiments is a cryocooler, extends through the vacuum vessel 24 within a cooling head collar 30 (e.g., a housing). The cold end of the cooling head 28 can thus be arranged within the cooling head collar 30, without affecting the vacuum within the vacuum container 2 4. The cooling head 28 is inserted (or received) and secured within the cooling head collar 30 using any suitable means, such as one or more flanges and bolts, or other means known in the art. In addition, a motor 32 of the cooling head 28 is provided outside of the vacuum vessel 24.
    As shown in FIG. 2, in various embodiments, the cooling head collar 30 includes a condenser 36 at a lower end of the cooling head collar 30 that has a portion that may extend into the helium tank 22. The condenser 36 condenses vaporized helium gas from the helium vessel 22. The condenser 36 is also coupled to the helium vessel 22 via one or more bridges 38. For example, the bridges 38 may be provided from the helium vessel 22 to the condenser 36 for transferring vaporized helium gas from the helium vessel 22 to the condenser 36, which then returns condensed liquid helium to the helium vessel 22 at the open end 34.
    [0028] A magnet 46, which in various embodiments is a superconductive magnet, is located within the helium vessel 22 and is controlled during operation of the MRI imaging system, as described in more detail herein, to obtain MRI image data. In addition, during operation of the MRI system, liquid helium within the helium container 22 of the MRI magnet system 20 cools the superconducting magnet 46, which may be configured as a coil assembly, as is known. The superconductive magnet 46 may be cooled to, for example, a superconducting temperature, such as 4.2 Kelvin (K). The cooling process may include condensing vaporized helium gas to liquid through the condenser 36 and returning it to the helium vessel 22. It should be understood that the vaporized helium may also flow through one or more optional gas bridges (not shown) carrying the helium vessel 22 connect the thermal shield 26.
    In various embodiments, thermal insulation 50 is provided around the helium vessel 22, which in one embodiment is formed as an MLI structure. For example, the MLI structure may include a plurality of reflector layers and a plurality of spacer layers as described below.
    In various embodiments, the thermal insulation 50 defines a thermal insulation blanket surrounding one or all portions of the helium vessel and / or the thermal shield 26 (shown as both the helium vessel and the thermal shield).
    SUSPENDED 11 as well as surrounding the thermal shield 26 only for illustration in FIGS. 1 and 2). For example, the thermal insulation 50 may extend circumferentially around the helium vessel 22 (containing liquid helium 56 therein), including surrounding an inner diameter surface 52 and an outer diameter surface 54, as shown in FIG. 3, which shows a simplified diagram of the arrangement , However, the thermal insulation 50 may extend only along the portions of the surface of the helium container 22, for example along the sides but not to the ends thereof. In other embodiments, the thermal insulation 50 defines a thermal insulation blanket that surrounds only a portion of the thermal shield 26 or only the thermal shield 26. In further embodiments, the thermal insulation 50 defines a thermal insulation blanket surrounding both the helium vessel 22 and the thermal shield 26 (which may be, for example, a structure of two blankets or a single blanket). The thermal insulation 50 may be placed or disposed about the helium vessel 22, the thermal shield 26, or both, in any suitable manner.
    The thermal insulation 50 includes a plurality of layers as shown in FIG. 4, wherein a portion of the thermal insulation 50 includes at least one deformed spacing layer 62 provided between at least one reflector layer 60 on each side. The coating layer (s) 62 is / are between two reflector
    RETURNED 12
    • ft ft layers, such as adjacent layers, inserted or arranged. It should be noted that adjacent layers are not necessarily abutting layers. The baffle layer 62 may therefore be deposited between two reflector layers 60 and extending therebetween from one reflector layer 60 to the next reflector layer 60 (or less than the distance between the two reflector layers 60). The reflector layers 60 and the spacer layers 62 may be formed of any suitable material for insulating the helium vessel 22 and / or the thermal shield 26, which may include reducing the heat transfer both into and out of the helium vessel 22 and / or the thermal shield 26 , As will be described in more detail below, the arrangement and design of the layers in various embodiments is given differently at a cold end of the thermal insulation 50, namely the end closer to the surface of the helium vessel 22 and / or the thermal shield 26, and a warm end of the thermal insulation 50, namely the end, which is farther away from the surface of the helium tank 22 and / or the thermal shield 26.
    Rather, for exemplary purposes, the reflector layers 60 may be formed of a double aluminized mylar material (Double-Aluminized Mylar, DAM). However, for example, the reflector layers 60 may be formed from various polymers that have reflective surfaces, such as surfaces coated with reflective material on both sides.
    FOLLOWING - 13 * * * * * * t * * * * * * • * ft. The spacer layers 62 may be formed, for example, of any type of non-conductive polymer layers, such as, but not limited to, woven fabric, silk, or viscose or polyester spun polyester, among others. The spacer layers 62 may be formed of a material that has a thermal conductivity that allows heat to pass from one reflector layer 60 to the next reflector layer 60. The spacer layers 62 generally define a space between adjacent reflector layers 60 and maintain the spacing between adjacent spacer layers 62.
    The spacer layers 62 are deformed such that the layers are formed of sheets of material that are deformed such that the sheets are not flat. For example, the spacer layers 62 are deformed such that when the spacer layers 62 surround the helium container 22 and / or the thermal shield 26, the spacer layers 62 do not have a constant diameter or thickness when the spacer layers 62 surround the helium container 22 and / or. or extend around the thermal shield 26. The spacer layers 62 are thus not uniform along their surface but have varying height or thickness.
    The spacer layers 62 may take any shape or shape. FIGS. 5 to 10 illustrate various embodiments of the spacer layers 62, which are shown in FIG.
    Be able to do so. However, variations are deepened and the
    Spacer layers 62 may be any type of deformed layer. For example, as shown in FIGS. 5 and 6, the spacer layers 62 may be formed from a generally pleated or crimped structure 70. It should be noted that although the pleats 72 are shown as having a generally triangular cross-section, the pleats 72 may take on various shapes and shapes. For example, the pleats 72 may have round ends or other polygonal configurations. In addition, the width and height of the pleats 72 may be varied, for example, based on a desired or required spacing between adjacent reflector layers 60. It should be understood that the pleats 72 may be folded back on one another at different degrees (as shown by arrows P) or not at all. In addition, the pleats 72 may extend along all or a portion of the spacer layer 62, as well as extending in one direction or in many different directions. The folding of the folded structure 70 may be accomplished using any suitable folding method, such as, but not limited to, an adhesion method, a printing method, or an adhesive method.
    As another example of a variation of the spacer layers 62, as shown in FIGS. 7 and 8, an embossed structure 80 may be given. The embossed structure 80 includes raised portions 82. It should be noted that the raised portions 82 are sized differently and
    15, and are not limited to the circular shapes and spaces shown in FIGS. 7 and 8. For example, the embossment may include forming raised portions 82 having square, rectangular, triangular, polygonal, or other shapes. Additionally, the spacing between the raised portions 82 may be the same or different, and the number of raised portions 82 may be changed as desired or needed, as well as along all or only a portion of the embossed structure 80. Further, the height and width of the raised portions 82 may be changed, for example, based on the desired or required spacing between adjacent reflector layers 60.
    Embossing to form the raised portions 82 may be accomplished using any suitable embossing techniques, such as by applying heat and / or pressure through molding tools {e.g. male or female copper or brass forming tools) that mate and deform (e.g., squeeze) the embossed structure 80, such as fibers of the substrate of the embossed structure 80.
    As another example of a variation of the spacer layers 62, as shown in FIGS. 9 and 10, a wrinkled structure 90 may be given. The wrinkled structure 90 includes knobs 92 within the substrate forming the spacer layers 62. It should be noted that the knobs 92, for example, any kind of wrinkles, curls or
    FOLLOW-UP 16 16
    • Ψ
    Waves of the substrate may be such that the height or thickness of the substrate varies. The width and height of the knobs 92 may be varied, for example, based on the desired or required spacing between adjacent reflector layers 60. It should be understood that the knobs 92 may be randomly formed as shown in Figs have different heights and depths, or alternatively they can be formed uniformly. The knobs 92 may extend in the same direction or in different directions as they may extend along the entire or a portion of the wrinkled structure 90.
    The wrinkling to form the knobs 92 may be accomplished using any suitable method, such as by treating the substrate, which forms the wrinkled structure 90 to form the nicks or wrinkles among other changes in the surface of the structure.
    In various embodiments, the deformed spacer layers 62 are provided between reflector layers 60 in a portion of thermal insulation 50. In addition, undeformed spacer layers 100 are provided between other reflector layers 60 in a portion of thermal insulation 50, which is shown diagrammatically in FIG. The spacer layers 100 may be formed from generally planar sheets of material (e.g., a non-conductive polymeric material) that does not deform
    When the spacing layers 100 circumferentially extend around the helium vessel 22 and / or the thermal shield 26, the spacing layers 100 are of a constant diameter or thickness so that they extend circumferentially about the helium vessel 22 and / or the thermal shield 26 , Therefore, the spacer layers 100 are generally uniform along the surface with a constant height or thickness.
    In one embodiment, as shown in FIG. 11, a plurality of spacer layers 100 are provided between adjacent reflector layers 60 at a warm end 102 of the thermal insulation 50 which defines the further (more distant) end to the helium vessel 22 (as in FIG FIG. 12) or the thermal shield 26. The arrangement of one or more spacer layers 100 between adjacent reflector layers 60 is repeated, for example, thirty times to form a portion of the thermal insulation 50. Thereafter, a plurality of spacer layers 62 are provided between adjacent reflector layers 60 at a cold end 104 of thermal insulation 50, which is the closer (denser) end to helium vessel 22 (as shown in FIG. 12) or thermal shield 26. The arrangement of one or more spacer layers 62 between adjacent reflector layers 60 is repeated, for example, five times to form a portion of the thermal insulation 50. It should be noted that the number of repetitions with which the various arrangements are repeated may be varied, as well as at various portions along the thermal insulation 50 and not only
    POSSIBLE - 18 * * • • • * ♦ 4 * * * * I * * * * * t can be created on two different sections. For example, in some embodiments, the repeated placement of one or more spacer layers 62 between adjacent reflector layers 60 may be between two and five times. The various layers may be bonded or coupled using any suitable attachment or bonding agent. It should be understood that the thermal insulation 50 can then be created surrounding and in thermal contact with the helium container, or at another location within the vacuum vessel 24 of the MRI system, such as surrounding the thermal shield 26.
    It should be noted that the reflector layers 60 are not deformed in various embodiments, for example formed by planar arcs of the reflector material. However, one or more of the reflector layers 60 may optionally be deformed similarly to the deformation of the spacer layers 62. It should be understood that the thickness of the layers may be the same or different and variable or constant over the thermal insulation 50.
    According to various embodiments, a method 110 is shown in Fig. 13 also provided to provide thermal insulation, such as thermal insulation 50, which may define, for example, an MLI ceiling. The method 110 includes deforming a plurality of spacer layers at 112, such as the FIG
    POSSIBLE 19 * * k * «· # ··« »* ·« • k
    Forming spacer layers having a varying thickness in cross-section. Next, at 114, a plurality of reflector layers having undeformed spacer layers (eg, constant thickness spacer layers) are stacked between the reflector layers to form a warm end of an MLI blanket, stacking toward a cold end of the MLI blanket at 116 will continue. The stacking is then continued at 118 with a plurality of reflector layers stacked with deformed spacer layers between the reflector layers to form a cold end of the MLI blanket. Once a desired or required number of layers have been stacked (eg, thirty nested layers at steps 114 and 116 and five nested layers at step 118), the layers are coupled together at 120. It should be understood that the layers are coupled together can be stacked while stacked or after the stack is complete, in addition to post-forming procedures such as sealing the MLI blanket.
    Thus, thermal insulation for an MRI system is provided in accordance with various embodiments. For example, an MLI blanket may be formed for a helium container or thermal shield or both for the MRI system, which may be a variable density MRI blanket.
    RETURNED 20 20
    It should be noted that while some embodiments are described in connection with superconducting magnets for the MRI system, various embodiments may be practiced in connection with any type of system having superconducting magnets. The superconducting magnets can be used in other types of medical imaging devices as well as non-medical imaging devices.
    Therefore, various embodiments may be practiced in conjunction with various types of superconducting coils, such as superconducting coils for an MRI system. For example, various embodiments with superconducting coils for use with an MRI system 140 shown in FIG. 14 may be practiced. It should be noted that although the system 140 is illustrated as a single mode imaging system, various embodiments may be practiced in or with a multi-modal imaging system. The system 140 is illustrated as an MRI imaging system and may be combined with various types of medical imaging systems, such as computed tomography (T), positron emission tomography (PET), single photon emission computed tomography (Single Photon Emission Tomography). SPECT) as well as an ultrasound system or any other system capable of producing images, especially of a human. Furthermore, the various embodiments are not related to medical imaging systems for imaging humans
    But may include veterinary or non-medical systems for imaging non-human objects, luggage, etc.
    Referring to Figure 14, the MRI system 140 generally includes an imaging section 142 and a processing section 144 that includes a processor or other computing or control device. The MRI system 140 includes within a cryostat 146 a superconducting magnet 46 formed from coils that may be supported on a solenoid support structure. The helium vessel 22 surrounds the superconducting magnet 46 and is filled with liquid helium.
    The thermal insulation 152 is provided surrounding all or a portion of the outer surface of the helium container 22 and / or the thermal shield 26 (shown in Figs. 1 and 2). Thermal insulation 152 may take the form of thermal insulation 50 as described herein. A plurality of magnetic gradient coils 154 are disposed within the superconducting magnet 46, and an RF transmitting coil 156 is provided within the plurality of magnetic grade coils 154. In some embodiments, the RF transmit coil 156 may be replaced with a transmit and receive coil. The components within the framework 146 generally form the imaging section 142. It should be understood that although the superconductive magnet 46 has a cylindrical shape.
    REPRODUCED 22 * * ·······································································································································································································
    The processing section 154 generally includes a controller 158, a main magnetic field controller 160, a field gradient controller 162, a memory 164, a display device 166, a transmit / receive TR switch 168, an RF transmitter 170, and a receiver 172.
    During operation, the body of an object, such as a patient or a shape to be imaged, is placed in a hole 174 on a suitable tray, for example a patient table. The superconducting magnet 46 produces a uniform and static main magnetic field B0 over the hole 174. The strength of the electromagnetic field in the hole 174 and, correspondingly, in the patient is controlled by the controller 158 via the main magnetic field controller 160 which also controls the supply of power to the superconducting magnet 46.
    The magnetic gradient coils 154, which include one or more gradient coil elements, are arranged to impose a magnetic gradient on the magnetic field B0 in the hole 174 within the superconducting magnet 46 in one or more of the three orthogonal directions x, y, and z. The magnetic gradient coils 154 are replaced by the
    REPLACED - 23
    Field gradient control 162 operated and also controlled by the controller 158.
    The RF transmit coil 156, which may include a plurality of coils, is configured to transmit magnetic pulses and / or optionally simultaneously detect MR signals from the patient when receive coil elements are also present, such as a surface coil. which is designed as RF-Emp-catch coil. The RF receive coil may be of any type or configuration, for example, a separate receive surface coil. The receive surface coil may be a field of RF coils created within the RF transmit coil 156.
    The RF transmit coil 156 and the receive surface coil are selectively connected to the RF transmitter 170 or corresponding to the receiver 172 via the T-R switch 168. RF transmitter 170 and T-R switch 168 are controlled by controller 158 such that RF field pulses or signals are generated by RF transmitter 170 and selectively applied to the patient to excite magnetic resonance in the patient. While the RF excitation pulses are being applied to the patient, the T-R switch 168 is also instructed to disconnect the receive surface coil from the receiver 172.
    Following the application of the RF pulses, the T-R switch 168 is again instructed to transmit the RF transmit coil 156
    READY 24 - »· 41 • * • * * Φ4 * *» * »··» »* · < from RF transmitter 170 and connect the receive surface coil to receiver 172. The receive surface coil is operated to detect or track MR signals originating from the excited nucleus in the patient and communicates the MR signals to the receiver 172. The controller 158 includes, for example, a processor (eg, an image reconstruction processor) that controls the Calculation of the MR signals controls to produce signals representing an image of the patient.
    The calculated signals representative of the image are also transmitted to the display 166 to provide a visual view of the image. In particular, the MR signals satisfy or form a k-space which is Fourier transformed to obtain a visible image. The calculated signals representative of the image are then transmitted to the display device 166.
    The various embodiments and / or components, for example, the modules or components and controls therein, such as the MRI system 140, may also be implemented as part of one or more computers or processors. The computer or processor may include a computing device, an input device, a display unit, and an interface, for example, as an internet access. The computer or processor may include a microprocessor. The microprocessor may be connected to a communication bus. The computer or processor may also have a memory
    POSSIBLE 25 * «* ·« · »» * »« · included. The memory may be RAM (Random Access Memory) and ROM (Read Only Memory). In addition, the computer or processor may include a storage device that may be a hard disk or a removable storage drive such as a floppy disk drive, an optical drive, and the like. The storage device may also be other similar means for loading computer programs or other instructions into a computer or processor.
    The term " computer " or "module" as used herein may include any processor-based or microprocessor-based system, including systems using micro-controllers, Reduced Instruction Set Computers (RISCs), Application Specific Integrated Circuits (ASICs), logic circuits, and any other circuit or processor. which is capable of performing the functions described here. The examples described above are exemplary only and therefore not meant to define and / or meaning the term "computer". in any way limit.
    The computer or processor executes a set of instructions stored in one or more memory elements to process the input data. The storage elements may also store data or other information as desired or needed. The storage element may be in the form of an information source or a physical storage element within a computing machine.
    The amount of instructions may include various commands directing the computer or processor as a calculator to perform special operations, such as methods and processes of various embodiments of the invention. The set of instructions may be in the form of a software program which may be part of a tangible, non-perishable computer-readable medium or media. The software may be in various forms, such as system software or application software. Furthermore, the software may be in the form of a collection of various programs or modules, a program module within a larger program or a portion of a program module. The software may also include modular programming in the form of object-oriented programming. The processing of the input data by the calculating machine may be in response to operating commands or in response to the results of previous processes or in response to a request made by another computing machine.
    The terms "software" and "firmware" as used herein may include any computer program stored in a memory for execution by a computer, including RAM memory, ROM memory, EPROM memory, EEPROM memory, and NVRAM memory (Non-Volatile RAM ). The aforementioned types of memory are exemplary only and therefore not limiting with respect to the types of memories that may be used to store a computer program.
    FOLLOW-UP 27 •
    It is understood that the foregoing description is meant to be illustrative and not restrictive. For example, the above-described embodiments (and / or aspects of them) may be used in combination with each other. In addition, many modifications may be made to the teachings of the various embodiments to adapt to a particular situation or material without departing from its scope. While the sizing and material types described herein are meant to define the parameters of various embodiments, they are in no way limiting, but rather exemplary. Many other embodiments will be apparent to those skilled in the art upon reading the description. The scope of various forms of embodiment should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which the claims refer. In the appended claims, the terms "contain " and "in which " as High German equivalents of the corresponding terms "comprising " and "where " used. Furthermore, in the following claims, the terms " first ", " second " and "third" etc. are mainly used as labels and not as numerical requirements of their objects. Furthermore, the limitations of the following claims are not in the form of means together with its function, and they are not intended to be interpreted on the basis of Section 112 (6) 35 USC until and unless such limitation of claim expressly includes the words "means to " followed by a
    1 REPLY 28 • * ··· «···« ·· · • • · say about the function that excludes another structure.
    This written description uses examples to disclose various embodiments, including the best mode, and also to enable those skilled in the art to practice various embodiments, including making and using any apparatus or systems, and performing all including methods. The patentable scope of the various embodiments is defined by the claims, and may include other examples that will become apparent to those skilled in the art. Such other examples are intended to be within the scope of the claims if the examples have structural elements that do not differ from the literal language of the claims, or the examples include structural elements with insubstantial differences from the literal language of the claims.
    SUBSEQUENT
    权利要求:
    Claims (11)
    [1]
    Claims 1. A thermal insulation (50) for a superconductive magnet, the thermal insulation comprising: a first plurality of reflector layers (60); an undeformed spacer layer (100) between adjacent layers a first plurality of reflector layers (60); and a deformed spacer layer (62) between adjacent layers in the second plurality of reflector layers.
    [2]
    The thermal insulation (50) of claim 1, wherein the first plurality of reflector layers (60) defines a warm end (102) of a multi-layered insulation (MLI) adapted to be removed to a helium vessel (22 ) or a thermal shield (26) or both.
    [3]
    3. The thermal insulation (50) of claim 1, wherein the second plurality of reflector layers (60) defines a cold end (104) of a multi-layered insulation (MLI) designed to be proximate to the end of a helium vessel {22) or a thermal shield (24) or both.
    [4]
    4. Thermal insulation deformed spacer layer (70).
    [5]
    5. Thermal insulation deformed spacer layer (80).
    [6]
    6. Thermal insulation deformed spacer layer (90).
    [7]
    7. Thermal insulation has deformed spacer layer. (50) according to claim 1, wherein said (62) is a folded structure (50) according to claim 1, wherein said (62) is an embossed structure (50) according to claim 1, wherein said (62) is a wrinkled structure (50) according to claim 1, where (62) is a variable strength
    [8]
    The thermal insulation (50) of claim 1, wherein a number of the first plurality of reflector layers (60) is greater than the number of the second plurality of reflector layers (60).
    [9]
    The thermal insulation (50) of claim 1, wherein the first and second plurality of reflector layers (60) are formed of generally planar sheets of material. Aftermath - 31 ♦ · - 31 ♦ ·


    [10]
    10. A method (110) of forming a thermal insulation for a magnetic resonance imaging (MRI) system, the method comprising: deforming (112) a plurality of spacer layers; Stacking (114) a first plurality of reflector layers with undeformed spacer layers therebetween; Stacking (118) a second plurality of reflector layers with deformed spacer layers therebetween; and forming (120) a multilayer thermal insulation with the first and second plurality of reflector layers. REPLACED 24 20

    FIG. 1

    FIG. 2 REPLACED • «* ♦

    FIG. 3 50 60 -62 1 60 FIG. 4 FOLLOWING * · »« ·· ............ • «· I ·» * I * · * * * * * * * * * * «* * *« *

    FIG. 7 FIG. 8th



    FIG. 10 FIG. 9 FOLLOW-UP »· · t * i * 50 60 1

    r- 62 r ~ 62: 5 x V 104 FIG.
    [11]
    11 102 60

    RETURNED 110

    FIG. 13 FOLLOW-UP • «· · * * • · · II 4 · · & & & • • • • • 4 4 4 4 4 4 4 4 4 4 4 * * 4 * 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 · * ·

    e > u_ REPLACED
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    同族专利:
    公开号 | 公开日
    AT511505A3|2015-06-15|
    GB201209702D0|2012-07-18|
    CN102830380A|2012-12-19|
    JP2013000582A|2013-01-07|
    AT511505B1|2015-07-15|
    GB2491943A|2012-12-19|
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    GB2491943B|2017-01-11|
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    法律状态:
    2019-02-15| MM01| Lapse because of not paying annual fees|Effective date: 20180612 |
    优先权:
    申请号 | 申请日 | 专利标题
    US13/159,253|US9389290B2|2011-06-13|2011-06-13|System and method for insulating a cryogen vessel|
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